Precise automatic placement of SMD components. We handle fine pitch,QFP, SOIC and TSOP. Placement from tape, feeder and tray.
Precise soldering of THT components without damaging surrounding SMD components. Ultrasonic nozzle cleaning, adjustable flux, convection preheating. Suitable for mixed PCBs (SMT + THT).
The oxygen-free inline process prevents oxidation — no overheating, uniform temperature across the entire PCB. Processes boards up to 600 × 500 mm. Full support for lead-free processes. Ideal for BGAs, QFPs, flip-chips and ceramic assemblies.
Manual and wave soldering of through-hole components. Suitable for connectors, transformers, relays and other THT components.
Soldering under a microscope, paste application, manual PCB coating. Commissioning and configuration of PCBs in accordance with the customer’s documentation. Functional verification and testing of the finished assembly.
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